Image shown is a representation only.
| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CYD09S72V18-200BBXI |
| Description | MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | CYD09S72V18-200BBXI Datasheet |
| In Stock | 726 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 128KX72 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.16 mm |
| Minimum Supply Voltage (Vsup): | 1.42 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 484 |
| No. of Words: | 131072 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B484 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 9437184 bit |
| Memory IC Type: | MULTI-PORT SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 72 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 23 mm |
| Maximum Access Time: | 3.3 ns |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 1.5 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.58 V |
