
Image shown is a representation only.
Manufacturer | Infineon Technologies |
---|---|
Manufacturer's Part Number | CYD18S72V-100BBXC |
Description | MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified; |
Datasheet | CYD18S72V-100BBXC Datasheet |
In Stock | 578 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .075 Amp |
Organization: | 256KX72 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Maximum Seated Height: | 1.9 mm |
Minimum Supply Voltage (Vsup): | 3.135 V |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 450 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 484 |
Maximum Clock Frequency (fCLK): | 100 MHz |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B484 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 23 mm |
Moisture Sensitivity Level (MSL): | 3 |
Input/Output Type: | COMMON |
No. of Ports: | 2 |
Memory Density: | 18874368 bit |
Minimum Standby Voltage: | 3.14 V |
Memory IC Type: | MULTI-PORT SRAM |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 72 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA484,22X22,40 |
Length: | 23 mm |
Maximum Access Time: | 5.2 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | PIPELINED ARCHITECTURE OR FLOW-THROUGH ARCHITECTURE |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 3.465 V |
Power Supplies (V): | 3.3 |