Infineon Technologies - CYD18S72V18-200BBXC

CYD18S72V18-200BBXC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CYD18S72V18-200BBXC
Description MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.42 V;
Datasheet CYD18S72V18-200BBXC Datasheet
In Stock888
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256KX72
Maximum Seated Height: 2.16 mm
Minimum Supply Voltage (Vsup): 1.42 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 484
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B484
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 18874368 bit
Memory IC Type: MULTI-PORT SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 72
No. of Functions: 1
Qualification: Not Qualified
Length: 23 mm
Maximum Access Time: 3.3 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 1.5
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.58 V
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