CYD36S36V18-200BBXC by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	CYD36S36V18-200BBXC
Description	MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
Datasheet	CYD36S36V18-200BBXC Datasheet
In Stock	313

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	1MX36
Maximum Seated Height:	2.16 mm
Minimum Supply Voltage (Vsup):	1.42 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	484
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B484
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	23 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	37748736 bit
Memory IC Type:	MULTI-PORT SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Qualification:	Not Qualified
Length:	23 mm
Maximum Access Time:	3.3 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	1.5
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	1.58 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
313	-	-

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