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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CYF1018V33L-100BGXI |
| Description | OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified; |
| Datasheet | CYF1018V33L-100BGXI Datasheet |
| In Stock | 175 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 512KX36 |
| Maximum Seated Height: | 1.96 mm |
| Minimum Supply Voltage (Vsup): | 1.425 V |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 500 mA |
| Cycle Time: | 41.67 ns |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 209 |
| Maximum Clock Frequency (fCLK): | 100 MHz |
| No. of Words: | 524288 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B209 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Width: | 14 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 18874368 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 36 |
| Output Enable: | YES |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA209,11X19,40 |
| Length: | 22 mm |
| Maximum Access Time: | 10 ns |
| No. of Words Code: | 512K |
| Nominal Supply Voltage / Vsup (V): | 1.5 |
| Additional Features: | ALSO REQUIRES 1.8V SUPPLY; SELECTABLE MEMORY ORGANIZATION-X9, X12 ,X16, X18, X20, X24, X32 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.575 V |
| Power Supplies (V): | 1.5,1.8,3.3 |
