Infineon Technologies - CYF2018V33L-100BGXI

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CYF2018V33L-100BGXI by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CYF2018V33L-100BGXI
Description OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
Datasheet CYF2018V33L-100BGXI Datasheet
In Stock121
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512KX36
Sub-Category: FIFOs
Surface Mount: YES
Maximum Supply Current: 500 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 209
Maximum Clock Frequency (fCLK): 100 MHz
No. of Words: 524288 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: R-PBGA-B209
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Memory Density: 18874368 bit
Memory IC Type: OTHER FIFO
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 36
Qualification: Not Qualified
Package Equivalence Code: BGA209,11X19,40
Maximum Access Time: 10 ns
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 3.3
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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