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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CYF2072V18L-100BGXI |
| Description | OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; |
| Datasheet | CYF2072V18L-100BGXI Datasheet |
| In Stock | 612 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 2MX36 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 500 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 209 |
| Maximum Clock Frequency (fCLK): | 100 MHz |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | R-PBGA-B209 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 75497472 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 36 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA209,11X19,40 |
| Maximum Access Time: | 10 ns |
| No. of Words Code: | 2M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8 |
