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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | FF900R12IE4V |
Description | N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 5100 W; Case Connection: ISOLATED; No. of Elements: 2; |
Datasheet | FF900R12IE4V Datasheet |
In Stock | 269 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Configuration: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
Transistor Element Material: | SILICON |
Maximum Gate-Emitter Threshold Voltage: | 6.4 V |
Polarity or Channel Type: | N-CHANNEL |
Surface Mount: | NO |
Minimum Operating Temperature: | -40 Cel |
Nominal Turn Off Time (toff): | 940 ns |
No. of Terminals: | 10 |
Maximum Power Dissipation (Abs): | 5100 W |
Maximum Collector-Emitter Voltage: | 1200 V |
Terminal Position: | UPPER |
Nominal Turn On Time (ton): | 350 ns |
Package Style (Meter): | FLANGE MOUNT |
JESD-30 Code: | R-PUFM-X10 |
No. of Elements: | 2 |
Package Shape: | RECTANGULAR |
Terminal Form: | UNSPECIFIED |
Maximum Operating Temperature: | 150 Cel |
Maximum Gate-Emitter Voltage: | 20 V |
Case Connection: | ISOLATED |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Maximum VCEsat: | 2.05 V |