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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | FM22LD16-55-BG |
Description | FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Data Retention Time: 10; |
Datasheet | FM22LD16-55-BG Datasheet |
In Stock | 334 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00027 Amp |
Organization: | 256KX16 |
Maximum Seated Height: | 1.2 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
Maximum Supply Current: | 12 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 48 |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Write Protection: | SOFTWARE |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B48 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 100000000000000 Write/Erase Cycles |
Package Code: | TFBGA |
Width: | 6 mm |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 4194304 bit |
Memory IC Type: | FRAM |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Package Equivalence Code: | BGA48,6X8,30 |
Length: | 8 mm |
Maximum Access Time: | 110 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Minimum Data Retention Time: | 10 |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .75 mm |
Maximum Supply Voltage (Vsup): | 3.6 V |