Infineon Technologies - FS900R08A2P2_B32

FS900R08A2P2_B32 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number FS900R08A2P2_B32
Description N-CHANNEL; Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 1546 W; Peak Reflow Temperature (C): NOT SPECIFIED; Case Connection: ISOLATED;
Datasheet FS900R08A2P2_B32 Datasheet
In Stock461
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR
Transistor Element Material: SILICON
Transistor Application: POWER CONTROL
Maximum Gate-Emitter Threshold Voltage: 6.5 V
Surface Mount: NO
Nominal Turn Off Time (toff): 820 ns
No. of Terminals: 33
Maximum Power Dissipation (Abs): 1546 W
Terminal Position: UPPER
Nominal Turn On Time (ton): 500 ns
Package Style (Meter): FLANGE MOUNT
JESD-30 Code: R-XUFM-X33
No. of Elements: 6
Package Shape: RECTANGULAR
Terminal Form: UNSPECIFIED
Maximum Operating Temperature: 150 Cel
Case Connection: ISOLATED
Polarity or Channel Type: N-CHANNEL
Minimum Operating Temperature: -40 Cel
Maximum Collector-Emitter Voltage: 750 V
Maximum Gate-Emitter Voltage: 20 V
Peak Reflow Temperature (C): NOT SPECIFIED
Maximum VCEsat: 1.25 V
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