Infineon Technologies - HYB18RL25616AC-5

HYB18RL25616AC-5 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB18RL25616AC-5
Description DDR1 DRAM; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Functions: 1; Sequential Burst Length: 2,4;
Datasheet HYB18RL25616AC-5 Datasheet
In Stock861
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX16
Output Characteristics: 3-STATE
Maximum Seated Height: 1.2 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.75 V
Sub-Category: DRAMs
Surface Mount: YES
No. of Terminals: 144
Maximum Clock Frequency (fCLK): 200 MHz
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B144
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: TBGA
Width: 11 mm
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 268435456 bit
Sequential Burst Length: 2,4
Memory IC Type: DDR1 DRAM
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA144,12X18,40/32
Length: 18.5 mm
Maximum Access Time: 30 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO REFRESH
Terminal Pitch: 1 mm
Maximum Supply Voltage (Vsup): 1.85 V
Power Supplies (V): 1.8,2.5
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