Infineon Technologies - HYB18T1G400AC-3

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HYB18T1G400AC-3 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB18T1G400AC-3
Description DDR2 DRAM; No. of Terminals: 68; Package Code: FBGA; Package Shape: RECTANGULAR; Width: 10 mm; Package Body Material: PLASTIC/EPOXY;
Datasheet HYB18T1G400AC-3 Datasheet
In Stock590
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX4
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 68
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B68
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: FBGA
Width: 10 mm
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Memory IC Type: DDR2 DRAM
Memory Width: 4
No. of Functions: 1
Qualification: Not Qualified
Length: 20 mm
Maximum Access Time: .45 ns
No. of Words Code: 256M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Maximum Supply Voltage (Vsup): 1.9 V
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