Infineon Technologies - HYB25D128323C-3

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HYB25D128323C-3 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB25D128323C-3
Description DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
Datasheet HYB25D128323C-3 Datasheet
In Stock62
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .065 Amp
Organization: 4MX32
Output Characteristics: 3-STATE
Maximum Seated Height: 1.5 mm
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 2.5 V
Sub-Category: DRAMs
Surface Mount: YES
Maximum Supply Current: 430 mA
Terminal Finish: TIN LEAD
No. of Terminals: 128
Maximum Clock Frequency (fCLK): 333 MHz
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B128
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 11 mm
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 134217728 bit
Self Refresh: YES
Sequential Burst Length: 2,4,8
Memory IC Type: DDR1 DRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 32
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA144,12X12,32
Refresh Cycles: 4096
Interleaved Burst Length: 2,4,8
Length: 11 mm
Maximum Access Time: .5 ns
No. of Words Code: 4M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: AUTO/SELF REFRESH
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.9 V
Power Supplies (V): 2.5
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