Infineon Technologies - HYB25D1G400ACL-5

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HYB25D1G400ACL-5 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB25D1G400ACL-5
Description DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 68; Package Code: TBGA; Package Shape: RECTANGULAR; Access Mode: FOUR BANK PAGE BURST;
Datasheet HYB25D1G400ACL-5 Datasheet
In Stock382
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX4
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 2.5 V
Surface Mount: YES
No. of Terminals: 68
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B68
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TBGA
Width: 10 mm
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Memory IC Type: DDR1 DRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 4
No. of Functions: 1
Qualification: Not Qualified
Length: 18 mm
Maximum Access Time: .7 ns
No. of Words Code: 256M
Nominal Supply Voltage / Vsup (V): 2.6
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.7 V
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Pricing (USD)

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