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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | HYB25R288180C-845 |
| Description | RAMBUS DRAM; No. of Terminals: 62; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M; Operating Mode: SYNCHRONOUS; |
| Datasheet | HYB25R288180C-845 Datasheet |
| In Stock | 807 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 16MX18 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 1.05 mm |
| Access Mode: | BLOCK ORIENTED PROTOCOL |
| Minimum Supply Voltage (Vsup): | 2.37 V |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 62 |
| Maximum Clock Frequency (fCLK): | 800 MHz |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B62 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Package Code: | TBGA |
| Width: | 10.5 mm |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 301989888 bit |
| Self Refresh: | YES |
| Memory IC Type: | RAMBUS DRAM |
| JESD-609 Code: | e0 |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA66,10X13,32 |
| Length: | 11 mm |
| Maximum Access Time: | 45 ns |
| No. of Words Code: | 16M |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Additional Features: | SELF CONTAINED REFRESH |
| Terminal Pitch: | .8 mm |
| Maximum Supply Voltage (Vsup): | 2.63 V |
| Power Supplies (V): | 1.8/2.5,2.5 |
