HYB25R72180C-745 by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	HYB25R72180C-745
Description	RAMBUS DRAM; No. of Terminals: 54; Package Code: BGA; Package Shape: RECTANGULAR; Technology: CMOS; Terminal Finish: Tin/Lead (Sn/Pb);
Datasheet	HYB25R72180C-745 Datasheet
In Stock	477

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4MX18
Output Characteristics:	3-STATE
Sub-Category:	DRAMs
Surface Mount:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	54
Maximum Clock Frequency (fCLK):	711 MHz
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B54
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Package Code:	BGA
Input/Output Type:	COMMON
Memory Density:	75497472 bit
Memory IC Type:	RAMBUS DRAM
JESD-609 Code:	e0
Memory Width:	18
Qualification:	Not Qualified
Package Equivalence Code:	BGA54,8X9,40/32
No. of Words Code:	4M
Terminal Pitch:	.8 mm
Power Supplies (V):	1.8/2.5,2.5

Pricing (USD)

Qty.	Unit Price	Ext. Price
477	-	-

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