Infineon Technologies - HYB39S256400DF-7

HYB39S256400DF-7 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB39S256400DF-7
Description SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 5.4 ns;
Datasheet HYB39S256400DF-7 Datasheet
In Stock585
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX4
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
No. of Terminals: 54
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B54
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TFBGA
Width: 8 mm
No. of Ports: 1
Memory Density: 268435456 bit
Self Refresh: YES
Memory IC Type: SYNCHRONOUS DRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 4
No. of Functions: 1
Qualification: Not Qualified
Length: 12 mm
Maximum Access Time: 5.4 ns
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

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