Infineon Technologies - HYE18M512160AF-8

HYE18M512160AF-8 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYE18M512160AF-8
Description DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet HYE18M512160AF-8 Datasheet
In Stock25
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0005 Amp
Organization: 32MX16
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
Maximum Supply Current: 75 mA
No. of Terminals: 60
Maximum Clock Frequency (fCLK): 100 MHz
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B60
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Input/Output Type: COMMON
Memory Density: 536870912 bit
Sequential Burst Length: 2,4,8,16
Memory IC Type: DDR1 DRAM
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: BGA60,9X10,32
Refresh Cycles: 8192
Interleaved Burst Length: 2,4,8,16
Maximum Access Time: 7 ns
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.8
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8
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