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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | IRF7779L2TR1PBF |
Description | N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 125 W; Package Body Material: UNSPECIFIED; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; |
Datasheet | IRF7779L2TR1PBF Datasheet |
In Stock | 818 |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Configuration: | SINGLE WITH BUILT-IN DIODE |
Transistor Element Material: | SILICON |
Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
Transistor Application: | SWITCHING |
Maximum Drain Current (ID): | 11 A |
Maximum Pulsed Drain Current (IDM): | 270 A |
Sub-Category: | FET General Purpose Power |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 9 |
Maximum Power Dissipation (Abs): | 125 W |
Terminal Position: | BOTTOM |
Package Style (Meter): | CHIP CARRIER |
JESD-30 Code: | R-XBCC-N9 |
No. of Elements: | 1 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | ENHANCEMENT MODE |
Maximum Operating Temperature: | 175 Cel |
Case Connection: | DRAIN |
Maximum Drain-Source On Resistance: | .0011 ohm |
Moisture Sensitivity Level (MSL): | 1 |
Avalanche Energy Rating (EAS): | 270 mJ |
Polarity or Channel Type: | N-CHANNEL |
JESD-609 Code: | e1 |
Minimum DS Breakdown Voltage: | 150 V |
Qualification: | Not Qualified |
Maximum Drain Current (Abs) (ID): | 67 A |