Infineon Technologies - MB39C308BGF-GE1

MB39C308BGF-GE1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number MB39C308BGF-GE1
Description POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet MB39C308BGF-GE1 Datasheet
In Stock938
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Width (mm): 9 mm
Maximum Seated Height: 1.3 mm
Minimum Supply Voltage (Vsup): 5.5 V
Surface Mount: YES
No. of Terminals: 208
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: MOS
JESD-30 Code: S-PBGA-B208
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
No. of Channels: 6
Package Code: LFBGA
Nominal Supply Voltage (Vsup): 7.2 V
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Other IC type: POWER SUPPLY SUPPORT CIRCUIT
Length: 9 mm
Adjustable Threshold: NO
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 12.6 V
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