Infineon Technologies - MB9AF131NBGL

MB9AF131NBGL by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number MB9AF131NBGL
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 112; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MB9AF131NBGL Datasheet
In Stock338
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 24 mA
ADC Channels: YES
No. of Terminals: 112
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
No. of I/O Lines: 84
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B112
Package Shape: SQUARE
ROM Words: 16384
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 10 mm
Speed: 20 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 5.5 V
RAM Bytes: 12288
External Data Bus Width: 0
Bit Size: 32
DAC Channels: YES
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA112,11X11,32
Length: 10 mm
PWM Channels: YES
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/5
CPU Family: CORTEX-M3
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