Infineon Technologies - PEF22827ELV1.1-G

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PEF22827ELV1.1-G by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number PEF22827ELV1.1-G
Description MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE;
Datasheet PEF22827ELV1.1-G Datasheet
In Stock50
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: MODEM
Sub-Category: Modems
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 225
Qualification: Not Qualified
Package Equivalence Code: BGA225,15X15,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B225
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8,3.3
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