PSB21393HV1.3 by Infineon Technologies | Telecommunications

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	PSB21393HV1.3
Description	TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Datasheet	PSB21393HV1.3 Datasheet
In Stock	785

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	2.45 mm
Surface Mount:	YES
Minimum Operating Temperature:	0 Cel
No. of Functions:	1
No. of Terminals:	44
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Length:	10 mm
Technology:	CMOS
JESD-30 Code:	S-PQFP-G44
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	70 Cel
Peak Reflow Temperature (C):	260
Package Code:	QFP
Width:	10 mm
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Moisture Sensitivity Level (MSL):	3

Pricing (USD)

Qty.	Unit Price	Ext. Price
785	-	-

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;

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