Image shown is a representation only.
| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | S25FL256SAGBAEA03 |
| Description | FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20; Package Style (Meter): GRID ARRAY, THIN PROFILE; |
| Datasheet | S25FL256SAGBAEA03 Datasheet |
| In Stock | 246 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0003 Amp |
| Organization: | 32MX8 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 1.2 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 100 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 24 |
| Maximum Clock Frequency (fCLK): | 133 MHz |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 125 Cel |
| Endurance: | 100 Write/Erase Cycles |
| Package Code: | TBGA |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Serial Bus Type: | SPI |
| Memory Density: | 268435456 bit |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Package Equivalence Code: | BGA24,5X5,40 |
| Alternate Memory Width: | 4 |
| Length: | 8 mm |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Minimum Data Retention Time: | 20 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1 mm |
| Maximum Supply Voltage (Vsup): | 3.6 V |
