S25FS064SAGBHB023 by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	S25FS064SAGBHB023
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Serial Bus Type: SPI;
Datasheet	S25FS064SAGBHB023 Datasheet
In Stock	9,632

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00009 Amp
Organization:	8MX8
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Maximum Supply Current:	100 mA
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	R-PBGA-B24
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	105 Cel
Package Code:	BGA
Width:	6 mm
Moisture Sensitivity Level (MSL):	3
Serial Bus Type:	SPI
Memory Density:	67108864 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Package Equivalence Code:	BGA24,5X5,40
Alternate Memory Width:	1
Length:	8 mm
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	1.8
Minimum Data Retention Time:	20
Parallel or Serial:	SERIAL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2 V
Reverse Pinout:	NO

Pricing (USD)

Qty.	Unit Price	Ext. Price
9,632	-	-

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