Infineon Technologies - S25HL02GTDPBHM053

S25HL02GTDPBHM053 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number S25HL02GTDPBHM053
Description FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Programming Voltage (V): 3; Package Body Material: PLASTIC/EPOXY;
Datasheet S25HL02GTDPBHM053 Datasheet
In Stock16
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00011 Amp
Organization: 256MX8
Output Characteristics: 3-STATE
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
Maximum Supply Current: 110 mA
No. of Terminals: 24
Maximum Clock Frequency (fCLK): 133 MHz
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Screening Level: AEC-Q100
Write Protection: HARDWARE
Technology: CMOS
JESD-30 Code: S-PBGA-B24
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Endurance: 2560000 Write/Erase Cycles
Package Code: TBGA
Width: 8 mm
Moisture Sensitivity Level (MSL): 3
Serial Bus Type: SPI
Memory Density: 2147483648 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: NOR TYPE
Package Equivalence Code: BGA24,5X5,40
Length: 8 mm
No. of Words Code: 256M
Nominal Supply Voltage / Vsup (V): 3
Minimum Data Retention Time: 25
Parallel or Serial: SERIAL
Terminal Pitch: 1 mm
Maximum Supply Voltage (Vsup): 3.6 V
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