Infineon Technologies - S26HS02GTFPBHB050

S26HS02GTFPBHB050 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number S26HS02GTFPBHB050
Description FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Memory Density: 2147483648 bit;
Datasheet S26HS02GTFPBHB050 Datasheet
In Stock275
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2GX1
Programming Voltage (V): 1.8
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 24
Maximum Clock Frequency (fCLK): 166 MHz
No. of Words: 2147483648 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B24
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Memory Density: 2147483648 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Type: NOR TYPE
No. of Words Code: 2G
Nominal Supply Voltage / Vsup (V): 1.8
Maximum Supply Voltage (Vsup): 2 V
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