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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | S26HS02GTFPBHB050 |
Description | FLASH; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Memory Density: 2147483648 bit; |
Datasheet | S26HS02GTFPBHB050 Datasheet |
In Stock | 275 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 2GX1 |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Surface Mount: | YES |
No. of Terminals: | 24 |
Maximum Clock Frequency (fCLK): | 166 MHz |
No. of Words: | 2147483648 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B24 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 105 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 2147483648 bit |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 1 |
No. of Functions: | 1 |
Type: | NOR TYPE |
No. of Words Code: | 2G |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Maximum Supply Voltage (Vsup): | 2 V |