Infineon Technologies - S29PL127J55BFW02

S29PL127J55BFW02 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number S29PL127J55BFW02
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: FBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet S29PL127J55BFW02 Datasheet
In Stock248
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Organization: 8MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 70 mA
Command User Interface: YES
No. of Terminals: 64
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B64
No. of Sectors/Size: 16,254
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Boot Block: BOTTOM/TOP
Memory Density: 134217728 bit
Sector Size (Words): 4K,32K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Page Size (words): 8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,10X12,32
Common Flash Interface: YES
Maximum Access Time: 55 ns
No. of Words Code: 8M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Data Polling: YES
Power Supplies (V): 3/3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
248 - -

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