Infineon Technologies - S29WS128POLBFW000

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S29WS128POLBFW000 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number S29WS128POLBFW000
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: FBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, FINE PITCH;
Datasheet S29WS128POLBFW000 Datasheet
In Stock114
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Organization: 8MX16
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 80 mA
Command User Interface: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 84
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B84
No. of Sectors/Size: 8,126
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 3
Boot Block: BOTTOM/TOP
Memory Density: 134217728 bit
Sector Size (Words): 16K,64K
Toggle Bit: YES
Memory IC Type: FLASH
JESD-609 Code: e1
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Page Size (words): 8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA84,10X12,32
Common Flash Interface: YES
Maximum Access Time: 13.5 ns
No. of Words Code: 8M
Nominal Supply Voltage / Vsup (V): 1.8
Ready or Busy: YES
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Data Polling: YES
Power Supplies (V): 1.8
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