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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | S70GL02GT12FHBV23 |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Command User Interface: NO; |
| Datasheet | S70GL02GT12FHBV23 Datasheet |
| In Stock | 765 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| No. of Sectors/Size: | 2K |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Package Code: | LBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Toggle Bit: | NO |
| Memory Width: | 16 |
| Package Equivalence Code: | BGA64,8X8,40 |
| Alternate Memory Width: | 8 |
| Minimum Data Retention Time: | 0.2 |
| Ready or Busy: | YES |
| Terminal Pitch: | 1 mm |
| Maximum Standby Current: | .0004 Amp |
| Organization: | 128MX16 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 1.4 mm |
| Maximum Supply Current: | 160 mA |
| Command User Interface: | NO |
| No. of Terminals: | 64 |
| No. of Words: | 134217728 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| JESD-30 Code: | R-PBGA-B64 |
| Maximum Operating Temperature: | 105 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Width: | 11 mm |
| Memory Density: | 2147483648 bit |
| Sector Size (Words): | 128K |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Page Size (words): | 16/32 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Common Flash Interface: | Y |
| Length: | 13 mm |
| Maximum Access Time: | 120 ns |
| No. of Words Code: | 128M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Parallel or Serial: | PARALLEL |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Data Polling: | YES |
