Image shown is a representation only.
| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | S72NS512RE0AHGGC3 |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 133; Package Code: FBGA; Package Shape: SQUARE; Organization: 32MX16; |
| Datasheet | S72NS512RE0AHGGC3 Datasheet |
| In Stock | 391 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32MX16 |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| No. of Terminals: | 133 |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B133 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Memory Density: | 536870912 bit |
| Mixed Memory Type: | FLASH+SDRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA133,14X14,20 |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8 |
