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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | S75WS256PEFJF5VS2 |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 115; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; |
| Datasheet | S75WS256PEFJF5VS2 Datasheet |
| In Stock | 648 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 16MX16 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.4 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| No. of Terminals: | 115 |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B115 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 9 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 268435456 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 12 mm |
| No. of Words Code: | 16M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 1.95 V |
