S98GL064NB0HI0072 by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	S98GL064NB0HI0072
Description	MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet	S98GL064NB0HI0072 Datasheet
In Stock	474

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4MX16
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	56
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B56
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	7 mm
Memory Density:	67108864 bit
Memory IC Type:	MEMORY CIRCUIT
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Length:	9 mm
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	3
Additional Features:	PSEUDO STATIC RAM IS ORGANISED AS 2M X 16
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
474	-	-

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