
Image shown is a representation only.
Manufacturer | Infineon Technologies |
---|---|
Manufacturer's Part Number | SAK-TC1197-512F180EAC |
Description | Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | SAK-TC1197-512F180EAC Datasheet |
In Stock | 721 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 600 mA |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 416 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B416 |
Package Shape: | SQUARE |
ROM Words: | 4194304 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 180 rpm |
RAM Bytes: | 131072 |
Bit Size: | 32 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA416,26X26,40 |
Peak Reflow Temperature (C): | 250 |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 1.5,2.5/3.3,3.3,5 |