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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | SLE66R01PNNBX1SA2 |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N2; |
| Datasheet | SLE66R01PNNBX1SA2 Datasheet |
| In Stock | 639 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 1216 bit |
| Organization: | 152X8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Terminals: | 2 |
| No. of Words: | 152 words |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 152 |
| JESD-30 Code: | X-XUUC-N2 |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIE |
| Temperature Grade: | OTHER |
