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Manufacturer | Infineon Technologies |
---|---|
Manufacturer's Part Number | TC275TP64F200WCAKXUMA1 |
Description | MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE; |
Datasheet | TC275TP64F200WCAKXUMA1 Datasheet |
In Stock | 721 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.17 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Surface Mount: | YES |
On Chip Data RAM Width: | 8 |
No. of DMA Channels: | 64 |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 40 MHz |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Package Code: | HLFQFP |
Bit Size: | 32 |
DAC Channels: | NO |
Package Equivalence Code: | QFP176,1.0SQ,20 |
PWM Channels: | NO |
Additional Features: | 48 A/D INPUT LINES |
Connectivity: | CAN(4), ETHERNET, I2C, QSPI(4) |
ROM Programmability: | FLASH |
Terminal Pitch: | .5 mm |
CPU Family: | TC27X |
Nominal Supply Voltage: | 1.3 V |
Maximum Seated Height: | 1.6 mm |
Maximum Supply Current: | 550 mA |
ADC Channels: | YES |
No. of Terminals: | 176 |
No. of Timers: | 2 |
DMA Channels: | YES |
Terminal Position: | QUAD |
Format: | FLOATING POINT |
Package Style (Meter): | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
No. of I/O Lines: | 111 |
JESD-30 Code: | S-PQFP-G176 |
ROM Words: | 4194304 |
Maximum Operating Temperature: | 125 Cel |
Width: | 24 mm |
Data EEPROM Size: | 384K |
Speed: | 200 rpm |
Peripheral IC Type: | MICROCONTROLLER |
Maximum Supply Voltage: | 1.43 V |
RAM Bytes: | 327680 |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 0 |
Peripherals: | DMA(64), POR, TIMER(2) |
Minimum Operating Temperature: | -40 Cel |
Length: | 24 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | AUTOMOTIVE |