Infineon Technologies - TC277TF64F200NDCKXUMA1

TC277TF64F200NDCKXUMA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number TC277TF64F200NDCKXUMA1
Description MICROCONTROLLER; Terminal Form: BALL; No. of Terminals: 292; Package Code: LFBGA; Package Shape: SQUARE; Bit Size: 32;
Datasheet TC277TF64F200NDCKXUMA1 Datasheet
In Stock583
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: NO
Maximum Seated Height: 1.7 mm
Surface Mount: YES
ADC Channels: YES
On Chip Data RAM Width: 8
No. of Terminals: 292
No. of Timers: 4
DMA Channels: YES
Terminal Position: BOTTOM
Format: FLOATING-POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
No. of DMA Channels: 64
Address Bus Width: 0
Screening Level: ISO 26262
Technology: CMOS
JESD-30 Code: S-PBGA-B292
Package Shape: SQUARE
ROM Words: 4194304
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: LFBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Speed: 200 rpm
Peripheral IC Type: MICROCONTROLLER
RAM Bytes: 483328
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 0
Peripherals: DMA(64), RTC, TIMER(4), WDT
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA292,20X20,32
Length: 17 mm
PWM Channels: NO
On Chip Program ROM Width: 8
Additional Features: 10xSENT, 3xPSI5, 1xPSI5S sensor interfaces AVAIABLE
Connectivity: ASCLIN(4), CAN(5), ETHERNET, I2C, I2S, QSPI(4)
ROM Programmability: FLASH
Terminal Pitch: .8 mm
CPU Family: TC27X
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