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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | TLE9272QXV33XUMA1 |
| Description | INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; |
| Datasheet | TLE9272QXV33XUMA1 Datasheet |
| In Stock | 529 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 13.5 V |
| Telecom IC Type: | INTERFACE CIRCUIT |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| No. of Functions: | 1 |
| No. of Terminals: | 48 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Screening Level: | AEC-Q100 |
| Length: | 7 mm |
| JESD-30 Code: | S-PQCC-N48 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Package Code: | HVQCCN |
| Width: | 7 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
