Integrated Device Technology - 70V3399S133BFI8

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70V3399S133BFI8 by Integrated Device Technology

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Manufacturer Integrated Device Technology
Manufacturer's Part Number 70V3399S133BFI8
Description MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Width: 15 mm;
Datasheet 70V3399S133BFI8 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .04 Amp
Organization: 128KX18
Output Characteristics: 3-STATE
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.7 mm
Minimum Supply Voltage (Vsup): 3.15 V
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 480 mA
Terminal Finish: TIN LEAD
No. of Terminals: 208
Maximum Clock Frequency (fCLK): 133 MHz
No. of Words: 131072 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B208
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Other Names: IDT70V3399S133BFI8
IDT70V3399S133BFI8-ND
Input/Output Type: COMMON
No. of Ports: 2
Memory Density: 2359296 bit
Minimum Standby Voltage: 3.15 V
Memory IC Type: MULTI-PORT SRAM
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Memory Width: 18
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA208,17X17,32
Length: 15 mm
Maximum Access Time: 15 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: PIPELINED OR FLOW-THROUGH ARCHITECTURE
Peak Reflow Temperature (C): 225
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.45 V
Power Supplies (V): 2.5/3.3,3.3
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