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| Manufacturer | Integrated Device Technology |
|---|---|
| Manufacturer's Part Number | 70V3399S133BFI8 |
| Description | MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Width: 15 mm; |
| Datasheet | 70V3399S133BFI8 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .04 Amp |
| Organization: | 128KX18 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 1.7 mm |
| Minimum Supply Voltage (Vsup): | 3.15 V |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 480 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 208 |
| Maximum Clock Frequency (fCLK): | 133 MHz |
| No. of Words: | 131072 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B208 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 15 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| No. of Ports: | 2 |
| Memory Density: | 2359296 bit |
| Minimum Standby Voltage: | 3.15 V |
| Memory IC Type: | MULTI-PORT SRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA208,17X17,32 |
| Length: | 15 mm |
| Maximum Access Time: | 15 ns |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | PIPELINED OR FLOW-THROUGH ARCHITECTURE |
| Peak Reflow Temperature (C): | 225 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.45 V |
| Power Supplies (V): | 2.5/3.3,3.3 |
