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Manufacturer | Integrated Device Technology |
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Manufacturer's Part Number | IDT70T3519S133BCI8 |
Description | MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; |
Datasheet | IDT70T3519S133BCI8 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .02 Amp |
Organization: | 256KX36 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Maximum Seated Height: | 1.5 mm |
Minimum Supply Voltage (Vsup): | 2.4 V |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 450 mA |
Terminal Finish: | Tin/Lead (Sn63Pb37) |
No. of Terminals: | 256 |
Maximum Clock Frequency (fCLK): | 133 MHz |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LBGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Input/Output Type: | COMMON |
No. of Ports: | 2 |
Memory Density: | 9437184 bit |
Minimum Standby Voltage: | 2.4 V |
Memory IC Type: | MULTI-PORT SRAM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 36 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA256,16X16,40 |
Length: | 17 mm |
Maximum Access Time: | 15 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Additional Features: | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Peak Reflow Temperature (C): | 225 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 2.6 V |
Power Supplies (V): | 2.5,2.5/3.3 |