Integrated Silicon Solution - IS43LQ32256A-062BLI

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IS43LQ32256A-062BLI by Integrated Silicon Solution

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Manufacturer Integrated Silicon Solution
Manufacturer's Part Number IS43LQ32256A-062BLI
Description LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
Datasheet IS43LQ32256A-062BLI Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX32
Maximum Seated Height: 1.1 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 200
Maximum Clock Frequency (fCLK): 1600 MHz
No. of Words: 268435456 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B200
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 10 mm
Other Names: 706-IS43LQ32256A-062BLI
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 8589934592 bit
Self Refresh: NO
Sequential Burst Length: 16,32
Memory IC Type: LPDDR4 DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 32
No. of Functions: 1
Package Equivalence Code: BGA200,12X22,32/25
Refresh Cycles: 16384
Interleaved Burst Length: 16,32
Length: 14.5 mm
No. of Words Code: 256M
Additional Features: TERM PITCH-MAX; ALSO REQUIRE SUPPLY VOLTAGE 1.06V TO 1.17V
Terminal Pitch: .65 mm
Maximum Supply Voltage (Vsup): 1.95 V
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