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Manufacturer | Intel |
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Manufacturer's Part Number | 10AX016E3F27E1HG |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | 10AX016E3F27E1HG Datasheet |
In Stock | 381 |
NAME | DESCRIPTION |
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Package Body Material: | Plastic/Epoxy |
Grading Of Temperature: | Other |
Organization: | 6151 CLBS |
Programmable IC Type: | FPGA |
Maximum Seated Height: | 3.35 mm |
No. of Inputs: | 240 |
Technology Used: | TSMC |
No. of Logic Cells: | 160000 |
No. of CLBs: | 6151 |
Surface Mount: | Yes |
No. of Outputs: | 240 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Position Of Terminal: | Bottom |
No. of Terminals: | 672 |
Package Equivalence Code: | BGA672,26X26,40 |
Package Style (Meter): | Grid Array |
Length: | 27 mm |
JESD-30 Code: | S-PBGA-B672 |
Form Of Terminal: | Ball |
Package Shape: | Square |
Pitch Of Terminal: | 1 mm |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | BGA |
Width: | 27 mm |