Intel - 10M25DAF256C8G

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10M25DAF256C8G by Intel

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Manufacturer Intel
Manufacturer's Part Number 10M25DAF256C8G
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet 10M25DAF256C8G Datasheet
In Stock135
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: Plastic/Epoxy
Organization: 1563 CLBS
Maximum Seated Height: 1.55 mm
No. of Inputs: 360
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 360
Position Of Terminal: Bottom
No. of Terminals: 256
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.25 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 25000
No. of CLBs: 1563
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Power Supplies (V): 1.2 V
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