Intel - 5AGXFB7H4F35I3G

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5AGXFB7H4F35I3G by Intel

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Manufacturer Intel
Manufacturer's Part Number 5AGXFB7H4F35I3G
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
Datasheet 5AGXFB7H4F35I3G Datasheet
In Stock925
NAME DESCRIPTION
Minimum Supply Voltage: 1.12 V
Package Body Material: Plastic/Epoxy
Organization: 19024 CLBS
Maximum Seated Height: 2.7 mm
No. of Inputs: 704
Surface Mount: Yes
No. of Outputs: 704
Position Of Terminal: Bottom
No. of Terminals: 1152
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B1152
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: HBGA
Width: 35 mm
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.18 V
Nominal Supply Voltage (V): 1.15
Technology Used: TSMC
No. of Logic Cells: 504000
No. of CLBs: 19024
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA1152,34X34,40
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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