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| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | AF82801IBM |
| Description | Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; |
| Datasheet | AF82801IBM Datasheet |
| In Stock | 171 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Boundary Scan: | NO |
| Surface Mount: | YES |
| No. of Terminals: | 676 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B676 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | BGA |
| Bus Compatibility: | PCI; USB; LPC |
