Intel - EP1C12F324I7

EP1C12F324I7 by Intel

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Manufacturer Intel
Manufacturer's Part Number EP1C12F324I7
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet EP1C12F324I7 Datasheet
In Stock2,734
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 1206 CLBS
Maximum Time At Peak Reflow Temperature (s): 20 s
Maximum Seated Height: 2.2 mm
No. of Inputs: 249
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 249
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 320 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
No. of Logic Cells: 12060
No. of CLBs: 1206
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 220 °C (428 °F)
Power Supplies (V): 1.5,1.5/3.3 V
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