Intel - EP1C4F324C8N

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EP1C4F324C8N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP1C4F324C8N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet EP1C4F324C8N Datasheet
In Stock7,797
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 400 CLBS
Maximum Seated Height: 3.5 mm
No. of Inputs: 249
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 249
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 275 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
No. of Logic Cells: 4000
No. of CLBs: 400
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 19 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Power Supplies (V): 1.5,1.5/3.3 V
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Pricing (USD)

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