Intel - EP1C6F256C6N

EP1C6F256C6N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP1C6F256C6N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet EP1C6F256C6N Datasheet
In Stock62
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 598 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.2 mm
No. of Inputs: 185
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 185
Position Of Terminal: Bottom
No. of Terminals: 256
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 405 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
No. of Logic Cells: 5980
No. of CLBs: 598
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.5,1.5/3.3 V
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