Intel - EP2AGX125EF35I3N

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EP2AGX125EF35I3N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP2AGX125EF35I3N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE;
Datasheet EP2AGX125EF35I3N Datasheet
In Stock1,003
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Organization: 4964 CLBS
Maximum Seated Height: 2.6 mm
No. of Inputs: 612
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 612
Position Of Terminal: Bottom
No. of Terminals: 1152
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B1152
Maximum Clock Frequency: 500 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: HBGA
Width: 35 mm
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): .9
No. of Logic Cells: 118143
No. of CLBs: 4964
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA1152,34X34,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Power Supplies (V): 0.9,1.2/3.3,1.5,2.5 V
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