Intel - EP2AGX45DF25C6G

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EP2AGX45DF25C6G by Intel

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Manufacturer Intel
Manufacturer's Part Number EP2AGX45DF25C6G
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE;
Datasheet EP2AGX45DF25C6G Datasheet
In Stock143
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Organization: 1805 CLBS
Maximum Seated Height: 2.15 mm
No. of Inputs: 260
Surface Mount: Yes
No. of Outputs: 260
Position Of Terminal: Bottom
No. of Terminals: 572
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B572
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: HBGA
Width: 25 mm
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): 0.9
No. of Logic Cells: 42959
No. of CLBs: 1805
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA572,24X24,40
Length: 25 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
143 $710.400 $101,587.200

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